Temperature instability-aware circuit

ABSTRACT

A circuit includes: a first type of swing reduction circuit coupled between an input/output pad and a buffer circuit; and a second type of swing reduction circuit coupled between the input/output pad and the buffer circuit, wherein the first type of swing reduction circuit is configured to increase a voltage received by respective gates of a first subset of transistors of the buffer circuit when a voltage applied on the input/output pad is equal to a first supply voltage, and the second type of swing reduction circuit is configured to reduce a voltage received by respective gates of a second subset of transistors of the buffer circuit when the voltage applied on the input/output pad is equal to a second supply voltage.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority to U.S. Provisional PatentApplication No. 62/595,469, filed on Dec. 6, 2017, which is incorporatedby reference herein in its entirety.

BACKGROUND

Continuing advances in technologies have led to increasingly reducingthe physical sizes of metal-oxide-semiconductor field-effect-transistors(MOSFETs). Magnitudes of supply voltages have been accordingly reducedto save power as well as to accommodate the reduction in the physicalsizes of the MOSFETs, and respective threshold voltages (V_(th)s) of theMOSFETs have also been reduced to mitigate performance degradationeffects of reduced MOSFET gate voltages resultant from the reduction ofsupply voltages. As a result, a Bias Temperature Instability (BTI)effect, causing a change in the magnitude of the MOSFET's V_(th), hasbecome a concern.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that various features are not necessarily drawn to scale. In fact,the dimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 illustrates an exemplary block diagram of a circuit including aswing reduction circuit, in accordance with some embodiments.

FIG. 2A illustrates an exemplary circuit diagram of the swing reductioncircuit, in accordance with some embodiments.

FIG. 2B illustrates another exemplary circuit diagram of the swingreduction circuit, in accordance with some embodiments.

FIG. 2C illustrates an exemplary comparison of voltage magnitudes atdifferent nodes of a swing reduction circuit, in accordance with someembodiments.

FIG. 2D illustrates another exemplary comparison of voltage magnitudesat different nodes of a swing reduction circuit, in accordance with someembodiments.

FIG. 3 illustrates a flow chart of an exemplary method to operate theswing reduction circuit of FIG. 1, in accordance with variousembodiments.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The following disclosure describes various exemplary embodiments forimplementing different features of the subject matter. Specific examplesof components and arrangements are described below to simplify thepresent disclosure. These are, of course, merely examples and are notintended to be limiting. For example, it will be understood that when anelement is referred to as being “connected to” or “coupled to” anotherelement, it may be directly connected to or coupled to the otherelement, or one or more intervening elements may be present.

A BTI effect is a device degradation mechanism identified in sub-100 nmMOSFETs. For example, when the gate of a p-type MOSFET is negativelybiased with respect to its source at an elevated temperature, oxideinterface traps are generated due to an interaction of holes in thechannel inversion layer with gate oxide. The instability is measured asan increase in the magnitude of the p-type MOSFET's V_(th). Higherstress temperatures generally produce more degradation. Similardegradation occurs to an n-type MOSFET when the gate of the n-typeMOSFET is positively biased with respect to its source. In general, theBTI effects observed in p-type and n-type MOSFETs are referred to as“Negative BTI (NBTI) effect” and “Positive BTI (PBTI) effect,”respectively. The NBTI/PBTI effect is known to cause reliabilityperformance degradation for the MOSFET because of the change in V_(th).

Such BTI effects can cause a more serious issue to an input/output (I/O)buffer circuit because, typically, the I/O buffer circuit is directlycoupled to a bonding pad configured to receive a supply voltage, whosemagnitude ranges from a minimum nominal voltage (e.g., a voltage sourcesource or a ground voltage (VSS)) to a maximum nominal voltage (e.g., avoltage drain drain or a power supply voltage (VDD)). Due to such arelatively great change in the magnitude of the voltage received, theI/O buffer circuit, which is configured to avoid noise associated withthe supply voltage from receiving by a core logic circuit, may becomemalfunctioning over the time of use. Existing techniques to resolve thisissue generally rely on prediction models to simulate the BTI effects.To assure the reliability of the I/O buffer circuits, the predictionmodels frequently lead to an overdesign on various physical features ofthe I/O buffer circuits, which, in turn, can cause other issues such as,for example, a trade-off on a usable area, a trade-off on timingperformance, etc. Thus, existing techniques to provide reliable I/Obuffer circuits are not entirely satisfactory.

The present disclosure provides various embodiments of a swing reductioncircuit coupled between a bonding pad and an input/output (I/O) buffercircuit. In some embodiments, the swing reduction circuit includes ap-type swing reduction circuit that is coupled to respective gates of asubset of p-type metal-oxide-semiconductor field-effect-transistors(pMOSFETs) of the I/O buffer circuit, and/or an n-type swing reductioncircuit that is coupled to respective gates of a subset of n-typemetal-oxide-semiconductor field-effect-transistors (nMOSFETs) of the I/Obuffer circuit. In some embodiments, the p-type swing reduction circuitsis configured to increase the lower bound of a magnitude of a voltageswing received by the gates of the subset of pMOSFETs of the I/O buffercircuit; and the n-type swing reduction circuits is configured todecrease the higher bound of a magnitude of the voltage swing receivedby the gates of the subset of nMOSFETs of the I/O buffer circuit.Accordingly, the magnitude of the voltage swing received by therespective gates of the subsets of pMOSFETs and nMOSFETs is decreased.Due to such a decreased magnitude of the voltage swing, theabove-mentioned NBTI and PBTI effects can be substantially depressed tooccur to the coupled I/O buffer circuit.

FIG. 1 illustrates a block diagram of an exemplary circuit 100, inaccordance with various embodiments. The circuit 100 includes a bondingpad 102, a swing reduction circuit 104, an input/output (I/O) buffercircuit 106, and a core logic circuit 108. In some embodiments, thebonding pad 102 is configured to receive a supply voltage from a voltagesource (not shown); the swing reduction circuit 104, coupled to thebonding pad 104, is configured to reduce the magnitude of a voltageswing received by the I/O buffer circuit 106; and the I/O buffer circuit106, coupled to the swing reduction circuit 104, is configured toprevent noise associated with the supply voltage from being received bythe coupled core logic circuit 108 (e.g., any of various digitalcircuits that perform the main functions of the whole circuit 100).

In some embodiments, the I/O buffer circuit 106 includes one of variousbuffer circuits known in the art that can perform the above-mentionedfunction such as, for example, a Schmitt Trigger circuit, an invertercircuit, etc. According to some embodiments, the I/O buffer circuit 106is formed by a plurality of pMOSFETs and a plurality of nMOSFETs, whichwill be discussed below. To assure the pluralities of pMOSFETS andnMOSFETs to minimally suffer the BTI effects, in some embodiments, theswing reduction circuit 104 may include a p-type swing reduction circuit104P and an n-type swing reduction circuit 104N configured to minimizethe NBTI effect that may occur to the plurality of pMOSFETs of the I/Obuffer circuit 106 and the PBTI effect that may occur to the pluralityof nMOSFETs of the I/O buffer circuit 106, respectively.

More specifically, in some embodiments, the p-type swing reductioncircuit 104P is configured to increase the magnitude of a voltagereceived by respective gates of the plurality of pMOSFETs of the I/Obuffer circuit 106 when the magnitude of the supply voltage, received bythe bonding pad 102, is equal to a minimum nominal voltage, for example,a voltage source source (VSS); and the n-type swing reduction circuit104N is configured to decrease the magnitude of a voltage received byrespective gates of the plurality of nMOSFETs of the I/O buffer circuit106 when the magnitude of the supply voltage, received by the bondingpad 102, is equal to a maximum nominal voltage, for example, a voltagedrain drain (VDD). As such, the magnitude of the voltage swing, receivedby the respective gates of the pluralities of pMOSFETs and nMOSFETs ofthe I/O buffer circuit 106, can be substantially reduced, whichadvantageously lengthens the lifetime of the I/O buffer circuit 106without making any of the above-mentioned trade-offs (because of nooverdesign on the I/O buffer circuit 106).

It is noted that the swing reduction circuit 104 may include only one ofthe p-type swing reduction circuit 104P and the n-type swing reductioncircuit 104N, according to some embodiments. When the plurality ofnMOSFETs of the I/O buffer circuit 106 do not have the concern of thePBTI effect, for example, the swing reduction circuit 104 may notinclude the n-type swing reduction circuit 104N. Similarly, when theplurality of pMOSFETs of the I/O buffer circuit 106 do not have theconcern of the NBTI effect, for example, the swing reduction circuit 104may not include the p-type swing reduction circuit 104P.

FIG. 2A illustrates respective schematic diagrams of the p-type swingreduction circuit 104P and the n-type swing reduction circuit 104N, inaccordance with an embodiment of the present disclosure. In theillustrated embodiment of FIG. 2A, the p-type swing reduction circuit104P and the n-type swing reduction circuit 104N are respectivelycoupled between the bonding pad 102 and the I/O buffer circuit 106,which is implemented by a Schmitt Trigger circuit. Although the I/Obuffer circuit 106 includes a Schmitt Tigger circuit in FIG. 2A, it isunderstood that the I/O buffer circuit 106 can include any of the buffercircuits known in the art while remaining within the scope of thepresent disclosure.

As mentioned above, in some embodiments, the bonding pad 102 isconfigured to receive a supply voltage 201. The magnitude of such asupply voltage 201 may range from a minimum nominal voltage (e.g., avoltage source source (VSS)) to a maximum nominal voltage (e.g., avoltage drain drain (VDD)). In some embodiments, the p-type swingreduction circuit 104P includes a transistor 202 (e.g., a pMOSFET) withits gate coupled to a supply voltage 203 whose magnitude is equal toVSS, which corresponds to a low logic state. As such, the transistor 202is turned on, for example, operating at a linear conduction mode. It isunderstood that the transistor 202 can be implanted by any of othervarious transistors (e.g., a bipolar junction transistor (BJT), ahigh-electron-mobility field-effect-transistor (HEMFET), etc.) whileremaining within the scope of the present disclosure. On the other hand,the n-type swing reduction circuit 104N includes a transistor 204 (e.g.,an nMOSFET) with its gate coupled to a supply voltage 205 whosemagnitude is equal to VDD, which corresponds to a high logic state. Assuch, the transistor 204 is turned on, for example, operating at alinear conduction mode. It is understood that the transistor 204 can beimplanted by any of other various transistors (e.g., a bipolar junctiontransistor (BJT), a high-electron-mobility field-effect-transistor(HEMFET), etc.) while remaining within the scope of the presentdisclosure. In some embodiments, the bonding pad 102 is commonly coupledto a source of the transistor 202 and a drain of the transistor 204. Adrain of the transistor 202 is coupled to a node “X,” and a source ofthe transistor 204 is coupled to a node “Y.”

In accordance with some embodiments, the I/O buffer circuit 106, whichis implemented as a Schmitt Trigger circuit, includes transistors M1,M2, M3, M4, M5, and M6. Although in the illustrated embodiment of FIG.2A, the transistors M1, M2, and M5 are each implemented by a pMOSFET andthe transistors M3, M4, and M6 are each implemented by an nMOSFET, it isunderstood that the transistors M1 to M6 can be implemented by any ofother transistors while remaining within the scope of the presentdisclosure. The I/O buffer circuit 106 is coupled between (e.g., biasedby) the supply voltages 205 (VDD) and 203 (VSS). Specifically, sourcesof the transistors M1 and M4 are coupled to the supply voltages 205(VDD) and 203 (VSS), respectively. Respective gates of the transistorsM1 and M2, tied at the node X, form a first input of the I/O buffercircuit 106 (hereinafter “input X”); respective gates of the transistorsM3 and M4, tied at the node Y, form a second input of the I/O buffercircuit 106 (hereinafter “input Y”); and respective gates of thetransistors M5 and M6, tied at node “Z,” form an output of the I/Obuffer circuit 106 (hereinafter “output Z”). In some embodiments, theoutput Z is coupled to the core logic circuit 108. In some embodiments,a drain of the transistor M1 is coupled to a source of the transistor M2at a common node coupled to a source of the transistor M5; a source ofthe transistor M3 is coupled to a drain of the transistor M4 at a commonnode coupled to a source of the transistor M6; and such stacked pairs oftransistors (M1 and M2) and (M3 and M4) are coupled to the node Z. Insome embodiments, drains of the transistors M5 and M6 are coupled to thesupply voltages 203 (VSS) and 205 (VDD), respectively.

In order to cause the swing reduction circuit 104 to reduce the voltageswing received by the I/O buffer circuit 106, in some embodiments, thep-type swing reduction circuit 104P and n-type swing reduction circuit104N are configured to increase the magnitude of a voltage present atthe node X when the magnitude of the supply voltage 201 is equal to VSSand decrease the magnitude of a voltage present at the node Y when themagnitude of the supply voltage 201 is equal to VDD, respectively.

For example, while increasing the magnitude of the voltage present atthe node X (i.e., when the magnitude of supply voltage 201=VSS), sincethe increased amount of voltage is predefined and substantially smallwith respect to VDD (which corresponds to the logic high state), in someembodiments, the I/O buffer circuit 106 may receive the logic statepresent at the node X as a logic low state (“logic 0”). In someembodiments, the increased amount of the voltage at the node X issubstantially equal to a threshold voltage of the transistor 202. On theother hand, since the magnitude of the voltage present at the node Yremains at VSS (as the transistor 204 is turned on to be in the linearconduction mode), in some embodiments, the I/O buffer circuit 106 mayreceive the logic state present at the node Y as logic 0, as well. Assuch, when the magnitude of supply voltage 201=VSS, the I/O buffercircuit 106 receives its both inputs (inputs X and Y) as logic 0 butwith the voltage magnitude at the node X increased by the thresholdvoltage of the transistor 202. FIG. 2C illustrates an exemplarycomparison of voltage magnitudes at different nodes of the p-type swingreduction circuit 104P and the n-type swing reduction circuit 104N inFIG. 2A, in accordance with some embodiments. As shown in the exemplarycomparison 231 of FIG. 2C, when the voltage magnitude (V_PAD) 201 at thepad 102 is equal to VSS, the voltage magnitude (V_PAD_P) at the node Xis increased by the threshold voltage (Vth(MPa)) of the transistor 202.

While decreasing the magnitude of the voltage present at the node Y(i.e., when the magnitude of supply voltage 201=VDD), since thedecreased amount of voltage is predefined and substantially small withrespect to VDD (which corresponds to the logic high state), in someembodiments, the I/O buffer circuit 106 may receive the logic statepresent at the node Y as a logic high state (“logic 1”). In someembodiments, the decreased amount of the voltage at the node Y issubstantially equal to a threshold voltage of the transistor 204. On theother hand, since the magnitude of the voltage present at the node Xremains at VDD (as the transistor 202 is turned on to be in the linearconduction mode), in some embodiments, the I/O buffer circuit 106 mayreceive the logic state present at the node X as logic 1, as well. Assuch, when the magnitude of supply voltage 201=VDD, the I/O buffercircuit 106 receives its both inputs (inputs X and Y) as logic 1 butwith the voltage magnitude at the node Y decreased by the thresholdvoltage of the transistor 204. As shown in the exemplary comparison 232of FIG. 2C, when the voltage magnitude (V_PAD) 201 at the pad 102 isequal to VDD, the voltage magnitude (V_PAD_N) at the node Y is decreasedby the threshold voltage (Vth(MNa)) of the transistor 204.

In some embodiments, the I/O buffer circuit 106, implemented as theSchmitt Trigger circuit, functions as a level-detecting comparator witha hysteresis window. Its output (e.g., output Z) transitions from logic0 to logic 1 when an increasing input voltage crosses an upper switchingthreshold V_(hi), and reverts back to its initial logic state only whenthe input voltage crosses a lower threshold level V_(lo) which is lessthan V_(hi). The difference between the two threshold levels,V_(hi)-V_(lo), is the hysteresis window associated with the SchmittTrigger circuit. Since the Schmitt Trigger circuit is known by personsof ordinary skill in the art, operation of the I/O buffer circuit 106will only be briefly described below.

In operation, assume that the logic states at the input X and Y areinitially logic 0 (e.g., when the magnitude of supply voltage 201=VSS asmentioned above). The transistors M1 and M2 will thus be turned on,while the transistors M3 and M4 will be turned off, which ties theoutput Z to VDD, i.e., logic 1. In turn, the transistor M5 is hold beingturned off and the transistor M6 is hold be turned on to set node “A” atlogic 1.

Assume now that the voltages at the nodes X and Y begins to rise (e.g.,when the magnitude of supply voltage 201 transitions to VDD). When thevoltages have become great enough, the transistors M3 and M4 will becomeconducted (i.e., turned on), while the transistors M1 and M2 will beturned off. When the conducted transistor M4 connects the node A to thesupply voltage 203 (VSS, or ground), which in turn grounds the output Zthrough the also conducted transistor M3, i.e., the output Ztransitioning to logic 0. However, the transistor M4 has to overcome theconnection of VDD to the node A (through the transistor M6) before itcan place the output Z in logic 0. Relative sizes of the transistors M3,M4, and M6 are selected to set the upper switching threshold V_(hi) atwhich the output Z transitions from logic 0 to logic 1. Conversely, oncethe output Z is at logic 0, the transistor M5 is held being turned on byvirtue of its gate's ground connection through the transistors M3 andM4, while the transistors M1 and M2 are held being turned off. For theI/O buffer circuit 106 to revert the output Z to logic 1 when thevoltages at the node X and Y fall, the transistor M1 has to becomeconductive enough to overcome the grounding effects of the transistor M5and set node “B” at logic 1. This is the point at which the I/O buffercircuit 106 switches back to logic 0, and relative sizes of thetransistors M1, M2, and M5 are selected so that the lower switchingthreshold V_(lo) at which the output Z transitions from logic 1 to logic0, thus providing the proper amount of hysteresis window.

As mentioned above, the magnitude of the supply voltage 201, received bythe bonding pad 102, generally ranges from VSS to VDD, which may causedamage (e.g., BTI effects) to the I/O buffer circuit 106 over the timeof use. To advantageously minimize the BTI effects, the p-type swingreduction circuit 104P and n-type swing reduction circuit 104N of thepresent disclosure are configured to increase the magnitude of a voltagereceived by the gates of the p-type transistors of the I/O buffercircuit 106, for example, the transistors M1 and M2 (i.e., the magnitudeof the voltage present at the node X) from VSS when the magnitude of thesupply voltage 201 is equal to VSS and decrease the magnitude of avoltage received by the gates of the n-type transistors of the I/Obuffer circuit 106, for example, the transistors M3 and M4 (i.e., themagnitude of the voltage present at the node Y) from VDD when themagnitude of the supply voltage 201 is equal to VDD, respectively. Morespecifically, the increased magnitude of voltage is predefined as thethreshold voltage of the p-type swing reduction circuit 104P'stransistor 202; and the decreased magnitude of voltage is predefined asthe threshold voltage of the n-type swing reduction circuit 104N'stransistor 204. Accordingly, the voltage swing received by thetransistors M1 and M2 can be advantageously reduced to VDD (when thesupply voltage 102 is equal to VDD) minus a sum of the threshold voltageof the transistor 202 and VSS (when the supply voltage 102 is equal toVSS); and the voltage swing received by the transistors M3 and M4 can beadvantageously reduced to VDD minus the threshold voltage of thetransistor 204 (when the supply voltage 102 is equal to VDD) then minusVSS (when the supply voltage 102 is equal to VSS).

In one embodiment, the p-type swing reduction circuit 104P can reducethe input buffer BTI degradation from 8.11% corresponding to anoverdesign on the I/O buffer circuit to 3.91%. In another embodiment,the p-type swing reduction circuit 104P can achieve a much smallerdevice size and/or a much better timing performance compared with anoverdesign on the I/O buffer circuit.

FIG. 2B illustrates respective schematic diagrams of the p-type swingreduction circuit 104P and the n-type swing reduction circuit 104N, inaccordance with another embodiment of the present disclosure. In theillustrated embodiment of FIG. 2B, the p-type swing reduction circuit104P and the n-type swing reduction circuit 104N are respectivelycoupled between the bonding pad 102 and the I/O buffer circuit 106,which is also implemented by a Schmitt Trigger circuit. For purposes ofbrevity, the discussion of the I/O buffer circuit 106 will not berepeated below.

In the illustrated embodiment of FIG. 2B, the p-type swing reductioncircuit 104P includes transistors 212 and 214; and the n-type swingreduction circuit 104N includes transistors 222 and 224. Although thetransistors 212 and 214 are each implemented by a pMOSFET and thetransistors 222 and 224 are each implemented by an nMOSFET in FIG. 2B,it is understood that the transistors 212 to 224 can be implemented byany of other transistors while remaining within the scope of the presentdisclosure. In some embodiments, the transistors 212 and 214 of thep-type swing reduction circuit 104P are gated by a supply voltage 215and drained by the supply voltage 215, respectively, whose magnitude(hereinafter “Vbias_P”) is between VSS and VDD; and the transistors 222and 224 of the n-type swing reduction circuit 104N are gated by a supplyvoltage 225 and sourced by the supply voltage 225, respectively, whosemagnitude (hereinafter “Vbias_N”) is between VSS and VDD.

More specifically, in the p-type swing reduction circuit 104P of FIG.2B, a source of the transistor 212 and a gate of the transistor 214 arecommonly coupled to the bonding pad 102, and a drain of the transistor212 and a source of the transistor 214 are commonly coupled to the nodeX (i.e., the respective gates of the pMOSFETs of the I/O buffer circuit106). In the n-type swing reduction circuit 104N of FIG. 2B, a drain ofthe transistor 222 and a gate of the transistor 224 are commonly coupledto the bonding pad 102, and a source of the transistor 222 and a drainof the transistor 224 are commonly coupled to the node Y (i.e., therespective gates of the nMOSFETs of the I/O buffer circuit 106).

Similar as the embodiment with reference to FIG. 2A, in order to causethe swing reduction circuit 104 to reduce the voltage swing received bythe I/O buffer circuit 106, in some embodiments, the p-type swingreduction circuit 104P and n-type swing reduction circuit 104N areconfigured to increase the magnitude of the voltage present at the nodeX when the magnitude of the supply voltage 201 received by the bondingpad 102 is equal to VSS and decrease the magnitude of the voltagepresent at the node Y when the magnitude of the supply voltage 201 isequal to VDD, respectively, except that the increased magnitude isdetermined according to Vbias_P (i.e., the magnitude of the supplyvoltage 215) and the decreased magnitude is determined according toVbias_N (i.e., the magnitude of the supply voltage 225).

For example, while increasing the magnitude of the voltage present atthe node X (i.e., when the magnitude of supply voltage 201=VSS), thetransistor 214 is gated by VSS, which corresponds to logic 0. Thus, thetransistor 214 is turned on. In some embodiments, since Vbias_P, atwhich the gate of the transistor 212 is biased, is greater than VSS, atwhich the source of the transistor 212 is biased, the transistor 212 maybe turned off. Accordingly, the voltage magnitude present at the node Xis pulled to be substantially equal to the voltage at which the drain ofthe transistor 214 is biased, i.e., Vbias_P. In some embodiments,Vbias_P is selected to be slightly greater than VSS, the I/O buffercircuit 106 may still receive the logic state present at the node X aslogic 0. On the other hand, the transistor 224 is also gated by VSS suchthat the transistor 224 is turned off. And the transistor 222 is gatedby Vbias_N, which is slightly greater than VSS, so that the transistor222 may be turned on, according to some embodiments. As such, thevoltage magnitude present at the node Y (the voltage present at thetransistor 222's source) is substantially equal to VSS (the voltagepresent at the transistor 222's drain), which causes the I/O buffercircuit 106 to receive the logic state present at the node Y as logic 0,as well.

In some embodiments, accordingly, the magnitude of the voltage presentat the node X (the magnitude of the voltage received by the transistorsM1 and M2) can be increased from VSS to Vbias_P when the supply voltage102 is equal to VSS. FIG. 2D illustrates an exemplary comparison ofvoltage magnitudes at different nodes of the p-type swing reductioncircuit 104P and the n-type swing reduction circuit 104N in FIG. 2B, inaccordance with some embodiments. As shown in the exemplary comparison241 of FIG. 2D, when the voltage magnitude (V_PAD) 201 at the pad 102 isequal to VSS, the voltage magnitude (V_PAD_P) at the node X is increasedfrom VSS to Vbias_P. Thus, the voltage swing received by the transistorsM1 and M2 can be advantageously reduced to VDD (when the supply voltage102 is equal to VDD) minus Vbias_P (when the supply voltage 102 is equalto VSS).

While decreasing the magnitude of the voltage present at the node Y(i.e., when the magnitude of supply voltage 201=VDD), the transistor 224is gated by VDD, which corresponds to logic 1. Thus, the transistor 224is turned on. In some embodiments, since Vbias_N, at which the gate ofthe transistor 222 is biased, is less than VDD, at which the gate of thetransistor 224 is biased, the transistor 222 may be less conductive thanthe transistor 224. Accordingly, the voltage magnitude present at thenode Y is pulled to be substantially equal to the voltage at which thesource of the transistor 224 is biased, i.e., Vbias_N. In someembodiments, Vbias_N is selected to be slightly less than VDD, the I/Obuffer circuit 106 may still receive the logic state present at the nodeY as logic 1. On the other hand, the transistor 214 is also gated by VDDsuch that the transistor 214 is turned off. And the transistor 212 isgated by Vbias_P, which is less than VDD, so that the transistor 212 maybe turned on, according to some embodiments. As such, the voltagemagnitude present at the node X (the voltage present at the transistor212's drain) is substantially equal to VDD (the voltage present at thetransistor 212's source), which causes the I/O buffer circuit 106 toreceive the logic state present at the node X as logic 1, as well.

In some embodiments, accordingly, the magnitude of the voltage presentat the node Y (the magnitude of the voltage received by the transistorsM3 and M4) can be decreased from VDD to Vbias_N when the supply voltage102 is equal to VDD. As shown in the exemplary comparison 242 of FIG.2D, when the voltage magnitude (V_PAD) 201 at the pad 102 is equal toVDD, the voltage magnitude (V_PAD_N) at the node Y is decreased from VDDto Vbias_N. Thus, the voltage swing received by the transistors M3 andM4 can be advantageously reduced to Vbias_N (when the supply voltage 102is equal to VDD) minus VSS (when the supply voltage 102 is equal toVSS).

FIG. 3 illustrates a flow chart of an exemplary method 300 to operatethe swing reduction circuit 104, in accordance with various embodiments.In various embodiments, the operations of the method 300 are performedby the respective components illustrated in FIGS. 1-2B. For purposes ofdiscussion, the following embodiment of the method 300 will be describedin conjunction with FIGS. 1-2B. The illustrated embodiment of the method300 is merely an example. Therefore, it should be understood that any ofa variety of operations may be omitted, re-sequenced, and/or added whileremaining within the scope of the present disclosure.

The method 300 starts with operation 302 in which an input voltageranging from VSS to VDD is received. For example, the input voltage maybe a supply voltage (e.g., the supply voltage 102) that is received by abonding pad (e.g., the bonding pad 102). As mentioned above, such asupply voltage 102 received by the bonding pad 102 typically ranges fromVSS, which is a minimum nominal supply voltage, to VDD, which is amaximum nominal supply voltage.

The method 300 continues to operation 304 in which the input voltage isdetermined as being equal to VSS or VDD. Continuing with the aboveexample, when the supply voltage 102 is equal to VSS, the methodproceeds to operation 306 and the following operation, and when thesupply voltage 102 is equal to VDD, the method proceeds to operation 310and the following operation, which will be respectively discussed below.

Referring first to the operation 306, a first voltage received by atleast one pMOSFET of an I/O buffer circuit is increased. Using the sameexample, when the supply voltage 102 is equal to VSS, the p-type swingreduction circuit 104P of the swing reduction circuit 104 is configuredto increase the voltage present at the node X, which corresponds to thefirst voltage discussed herein, from VSS by either the threshold voltageof the transistor 202 (as described with reference to FIG. 2A) or themagnitude of the supply voltage 215, Vbias_P (as described withreference to FIG. 2B).

Next, the method 300 continues to operation 308 in which the increasedfirst voltage is provided to the at least one pMOSFET of the I/O buffercircuit and VSS is provided to at least one nMOSFET of the I/O buffercircuit. Still with the same example, the pMOSFETs of the I/O buffercircuit 106 (e.g., the transistors M1 and M2) receive the increasedfirst voltage, i.e., the voltage present at the node X, as theirrespective inputs while the nMOSFETs of the I/O buffer circuit 106(e.g., the transistors M3 and M4) still receive VSS as their respectiveinputs.

Referring then to operation 310, a second voltage received by at leastone nMOSFET of the I/O buffer circuit is decreased. Using the sameexample, when the supply voltage 102 is equal to VDD, the n-type swingreduction circuit 104N of the swing reduction circuit 104 is configuredto decrease the voltage present at the node Y, which corresponds to thesecond voltage discussed herein, from VDD by either the thresholdvoltage of the transistor 204 (as described with reference to FIG. 2A)or the magnitude of the supply voltage 225, Vbias_N (as described withreference to FIG. 2B).

Next, the method 300 continues to operation 312 in which the decreasedsecond voltage is provided to the at least one nMOSFET of the I/O buffercircuit and VDD is provided to at least one pMOSFET of the I/O buffercircuit. Still with the same example, the nMOSFETs of the I/O buffercircuit 106 (e.g., the transistors M3 and M4) receive the decreasedsecond voltage, i.e., the voltage present at the node Y, as theirrespective inputs while the pMOSFETs of the I/O buffer circuit 106(e.g., the transistors M1 and M2) still receive VDD as their respectiveinputs.

In an embodiment, a circuit includes: a first type of swing reductioncircuit coupled between an input/output pad and a buffer circuit; and asecond type of swing reduction circuit coupled between the input/outputpad and the buffer circuit, wherein the first type of swing reductioncircuit is configured to increase a voltage received by respective gatesof a first subset of transistors of the buffer circuit when a voltageapplied on the input/output pad is equal to a first supply voltage, andthe second type of swing reduction circuit is configured to reduce avoltage received by respective gates of a second subset of transistorsof the buffer circuit when the voltage applied on the input/output padis equal to a second supply voltage.

In another embodiment, a circuit includes: a swing reduction circuitcoupled between an input/output pad and a buffer circuit, wherein theswing reduction circuit is configured to either increase an inputvoltage in response to the input voltage being equal to a first supplyvoltage and provide the increased input voltage to the buffer circuit,or decrease the input voltage in response to the input voltage beingequal to a second supply voltage and provide the decreased input voltageto the buffer circuit, and wherein the second supply voltage issubstantially greater than the first supply voltage.

In yet another embodiment, a method includes: receiving an input voltageranging from a first supply voltage to a second supply voltage; andeither increasing a first voltage received by at least one p-typemetal-oxide-semiconductor field-effect-transistor of a buffer circuit inresponse to the input voltage being equal to the first supply voltage,or decreasing a second voltage received by at least one n-typemetal-oxide-semiconductor field-effect-transistor of the buffer circuitin response to the input voltage being equal to the second supplyvoltage.

The foregoing outlines features of several embodiments so that thoseordinary skilled in the art may better understand the aspects of thepresent disclosure. Those skilled in the art should appreciate that theymay readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodimentsintroduced herein. Those skilled in the art should also realize thatsuch equivalent constructions do not depart from the spirit and scope ofthe present disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spiritand scope of the present disclosure.

What is claimed is:
 1. A circuit, comprising: a first type of swingreduction circuit coupled between an input/output pad and a buffercircuit; and a second type of swing reduction circuit coupled betweenthe input/output pad and the buffer circuit, wherein the first type ofswing reduction circuit is configured to increase a voltage received byrespective gates of a first subset of transistors of the buffer circuitwhen a voltage applied on the input/output pad is equal to a firstsupply voltage, and the second type of swing reduction circuit isconfigured to reduce a voltage received by respective gates of a secondsubset of transistors of the buffer circuit when the voltage applied onthe input/output pad is equal to a second supply voltage.
 2. The circuitof claim 1, wherein the second supply voltage is higher than the firstsupply voltage.
 3. The circuit of claim 1, wherein the first supplyvoltage is a ground voltage (VSS) and the second supply voltage is apower supply voltage (VDD).
 4. The circuit of claim 1, wherein the firstsubset of transistors of the buffer circuit are each a p-typemetal-oxide-semiconductor field-effect-transistor, and the second subsetof transistors of the buffer circuit are each an n-typemetal-oxide-semiconductor field-effect-transistor.
 5. The circuit ofclaim 1, wherein the first type of swing reduction circuit comprises ap-type metal-oxide-semiconductor field-effect-transistor, a gate of thep-type metal-oxide-semiconductor field-effect-transistor being coupledto the first supply voltage, a source of the p-typemetal-oxide-semiconductor field-effect-transistor being coupled to theinput/output pad, and a drain of the p-type metal-oxide-semiconductorfield-effect-transistor being coupled to the respective gates of thefirst subset of transistors of the buffer circuit.
 6. The circuit ofclaim 1, wherein the first type of swing reduction circuit comprises afirst p-type metal-oxide-semiconductor field-effect-transistor gated bya first bias voltage, and a second p-type metal-oxide-semiconductorfield-effect-transistor drained by the first bias voltage, the firstbias voltage being higher than the first supply voltage but lower thanthe second supply voltage.
 7. The circuit of claim 6, wherein a sourceof the first p-type metal-oxide-semiconductor field-effect-transistorand a gate of the second p-type metal-oxide-semiconductorfield-effect-transistor are both coupled to the input/output pad, and adrain of the first p-type metal-oxide-semiconductorfield-effect-transistor and a source of the second p-typemetal-oxide-semiconductor field-effect-transistor are both coupled tothe respective gates of the first subset of transistors of the buffercircuit.
 8. The circuit of claim 1, wherein the second type of swingreduction circuit comprises an n-type metal-oxide-semiconductorfield-effect-transistor, a gate of the n-type metal-oxide-semiconductorfield-effect-transistor being coupled to the second supply voltage, adrain of the n-type metal-oxide-semiconductor field-effect-transistorbeing coupled to the input/output pad, and a source of the n-typemetal-oxide-semiconductor field-effect-transistor being coupled to therespective gates of the second subset of transistors of the buffercircuit.
 9. The circuit of claim 1, wherein the second type of swingreduction circuit comprises a first n-type metal-oxide-semiconductorfield-effect-transistor gated by a second bias voltage, and a secondn-type metal-oxide-semiconductor field-effect-transistor sourced by thesecond bias voltage, the second bias voltage being higher than the firstsupply voltage but lower than the second supply voltage.
 10. The circuitof claim 9, wherein a drain of the first n-typemetal-oxide-semiconductor field-effect-transistor and a gate of thesecond n-type metal-oxide-semiconductor field-effect-transistor are bothcoupled to the input/output pad, and a source of the first n-typemetal-oxide-semiconductor field-effect-transistor and a drain of thesecond n-type metal-oxide-semiconductor field-effect-transistor are bothcoupled to the respective gates of the second subset of transistors ofthe buffer circuit.
 11. A circuit, comprising: a swing reduction circuitcoupled between an input/output pad and a buffer circuit, wherein theswing reduction circuit is configured to either increase an inputvoltage in response to the input voltage being equal to a first supplyvoltage and provide the increased input voltage to the buffer circuit,or decrease the input voltage in response to the input voltage beingequal to a second supply voltage and provide the decreased input voltageto the buffer circuit, and wherein the second supply voltage issubstantially greater than the first supply voltage.
 12. The circuit ofclaim 11, wherein the swing reduction circuit comprises a p-typemetal-oxide-semiconductor field-effect-transistor configured to increasethe input voltage in response to the input voltage being equal to thefirst supply voltage and provide the increased input voltage to thebuffer circuit.
 13. The circuit of claim 12, wherein the p-typemetal-oxide-semiconductor field-effect-transistor comprise: a gatecoupled to the first supply voltage, a source coupled to theinput/output pad, and a drain coupled to respective gates of at leastone p-type metal-oxide-semiconductor field-effect-transistor of thebuffer circuit.
 14. The circuit of claim 11, wherein the swing reductioncircuit comprises an n-type metal-oxide-semiconductorfield-effect-transistor configured to decrease the input voltage inresponse to the input voltage being equal to the second supply voltageand provide the decreased input voltage to the buffer circuit.
 15. Thecircuit of claim 14, the n-type metal-oxide-semiconductorfield-effect-transistor comprise: a gate coupled to the second supplyvoltage, a drain coupled to the input/output pad, and a source coupledto respective gates of at least one n-type metal-oxide-semiconductorfield-effect-transistor of the buffer circuit.
 16. The circuit of claim11, wherein the swing reduction circuit comprises: a first p-typemetal-oxide-semiconductor field-effect-transistor gated by a first biasvoltage; and a second p-type metal-oxide-semiconductorfield-effect-transistor drained by the first bias voltage, wherein thefirst bias voltage is higher than the first supply voltage but lowerthan the second supply voltage.
 17. The circuit of claim 11, wherein theswing reduction circuit comprises: a first n-typemetal-oxide-semiconductor field-effect-transistor gated by a second biasvoltage; and a second n-type metal-oxide-semiconductorfield-effect-transistor sourced by the second bias voltage, wherein thesecond bias voltage is higher than the first supply voltage but lowerthan the second supply voltage.
 18. A method, comprising: receiving aninput voltage ranging from a first supply voltage to a second supplyvoltage; and either increasing a first voltage received by at least onep-type metal-oxide-semiconductor field-effect-transistor of a buffercircuit in response to the input voltage being equal to the first supplyvoltage, or decreasing a second voltage received by at least one n-typemetal-oxide-semiconductor field-effect-transistor of the buffer circuitin response to the input voltage being equal to the second supplyvoltage.
 19. The method of claim 18, wherein the first supply voltage isa ground voltage (VSS) and the second supply voltage is a power supplyvoltage (VDD).
 20. The method of claim 18, wherein the first voltage isreceived by a gate of the at least one p-type metal-oxide-semiconductorfield-effect-transistor of the buffer circuit and the second voltage isreceived by a gate of the at least one n-type metal-oxide-semiconductorfield-effect-transistor of the buffer circuit.